Excellent Signal Integrity Performance

Thanks to the unique stub-less contact interface, balanced differential pairs and an optimized overmolded structure, based on FCI’s unique "wave" ground plane, the product provides a smooth, very well controlled impedance signal, with very low crosstalk throughout the connector over the entire 20Ghz bandwidth.

Revolutionary Beam on Beam Contact Interface

The ExaMAX™ mating interface utilizes a unique new beam-on-beam contact structure that creates 2 reliable points of contacts at all times and meets the requirements established in the Telcordia GR-1217 CORE specification.

The signal and ground contacts in this unique design are mirrored images of each other with each flexible beam making contact with its respective counterpart. They each exhibit similar force profiles as a function of mating insertion depth, resulting in a low mating force design with a consistent and reliable normal force.

The two points of contacts are maintained throughout the mating process and even when the connectors are subjected to angled mating conditions. Consequently the electrical stub-length remains very small at all times.

Videos:

• Dual receptacle mating beams in action
• 2 connectors mating and unmating at various angles

Compact Envelope

The connector row pitch has been designed to maintain the minimum connector width possible to allow for a very narrow card slot pitch, which aids in reducing the total backplane link loss or can be used to increase the routing spacing in-between card slots.

The high density, compact design also provides a daugh ter card connector with minimum height above the board allowing maximum airflow and reduces the required board real estate for the connector.

Connector Board Footprint Engineered for
Maximum Density and Signal Integrity Performance

The ExaMAX™ connector footprint design was optimized for minimal impedance discontinuity and crosstalk to allow for connector operation at both 25Gb/s and 40Gb/s respectively.

Differential pair through-holes within column are separated by larger ground through-holes to reduce intra-column crosstalk.

For 40Gb/s, a larger column spacing is used to allow for stitched ground via’s surrounding each differential pair that suppresses crosstalk within the footprint between adjacent column pairs resulting in a larger signal bandwidth.

Very short signal press-fit contacts and backdrilled through-holes are used to reduce the electrical stub within the footprint to enhance signal integrity performance. The connector is designed with a standard press fit dimension that does not required high aspect ratio drilling or plating which can result in a higher applied cost.

User Design Flexibility

ExaMAX™ connectors will be available in various column pitches allowing the designer to optimize card slot density or minimize board layer count for designs performing at 25Gb/s signal pair while also providing a path for maximum performance on high bandwidth, 40Gb/s per differential pair designs.

Cost Efficient Hard Metric Design

ExaMAX™ connectors can be used side by side with Millipacs & Airmax VS2/VSe signal, guide and power modules providing a cost effective solution for handling both high and low speed signals, In addition each row of the connector provides an additional low speed pin which can also be used for LF signals, short detect or power.

Robust Connector with No Exposed Pins

Fully protected terminals on both the daughter card and backplane connectors provide a robust connector system eliminating the risk and need to replace connectors due to bent or damage pins or blades resulting from contact stubbing during mating.

ExaMAX™ Meets OIF-25G-LR Specification

HIgh density 2mm column pitch performs and exceeds the requirements of the latest 25 Gbps standards including the OIF 25-G-LR specification.